Hanmi Semiconductor targets next-gen HBM with new plant
The semiconductor equipment maker is investing 57.8 billion won to build a dedicated hybrid bonder factory.
Hanmi Semiconductor is expanding its production capacity to support next-generation premium high bandwidth memory (HBM). The company is constructing its seventh plant with an investment of 57.8 billion won, which is intended to be a dedicated facility for the latest hybrid bonders. This construction is scheduled for completion by November 30, 2026, though the company noted the date may be adjusted based on corporate conditions.
This expansion follows a shift in the HBM landscape where technical difficulties in hybrid bonder development have delayed progress,. Consequently, there is a growing need for new equipment capable of stacking HBM chips with 20 or more layers using wider dies,. To address these structural changes in HBM, the company is preparing to launch a Wide TC bonder and is simultaneously developing hybrid bonders for both HBM and system semiconductor stacking,.
Financial results for the first half of 2026 show total semiconductor equipment revenue of 302.1 billion won. This total consists of 269.9 billion won from semiconductor manufacturing equipment and 32.2 billion won from conversion kits. In terms of regional performance, Asia accounted for the vast majority of revenue, totaling 282.2 billion won for the three-month cumulative period ending in June.
Export activity reached 228.5 billion won during the first half of 2026, while domestic sales totaled 73.5 billion won. These figures represent a decrease compared to the full year of 2025, when exports were 465.3 billion won and domestic sales were 111.4 billion won.
Regarding its corporate structure, the company maintains three unlisted subsidiaries. These include Hanmi Taiwan Co., Ltd., Hanmi Singapore Pte. Ltd., and Hanmi Vietnam Co., Ltd.,. The company noted that the Vietnam entity is currently undergoing liquidation proceedings,.