Aimechatec revenue rises on semiconductor business growth
Annual orders rose 60.6% to 43,289 million yen.
Aimechatec, Ltd. (TSE-6227) reported revenue of 35,244 million yen for the fiscal year ended June 30, 2026, up 67.8%, as wafer-level packaging bonding and debonding equipment drove growth in its semiconductor-related business.
Aimechatec's consolidated operating profit rose 177.3% from the previous fiscal year to 5,810 million yen.
Aimechatec's profit attributable to owners of the parent increased 954.1% from the previous fiscal year to 3,560 million yen.
Aimechatec's semiconductor-related business recorded annual revenue of 31,212 million yen, an increase of 59.9% from the previous fiscal year.
The semiconductor-related business earned segment profit of 8,752 million yen, up 4,992 million yen from the previous fiscal year.
Aimechatec attributed revenue and profit growth in its semiconductor business to steady performance by wafer-level packaging bonding and debonding equipment for advanced semiconductor packages, including those used for AI.
Aimechatec's wafer-level packaging bonders and debonders use technology that attaches semiconductor wafers to glass carriers and separates them again, providing equipment needed during wafer grinding and thinning.
Demand emerged for Aimechatec's solder-ball mounting systems for use in advanced semiconductor packages designed for AI applications.
Aimechatec's IJP solution business recorded revenue of 1,853 million yen, an increase of 1,280 million yen from the previous fiscal year.
The IJP solution business's segment loss widened to 689 million yen from a loss of 222 million yen in the previous fiscal year.
Aimechatec attributed the IJP solution business's loss to inventory valuation losses and other factors affecting the segment during the fiscal year.
Aimechatec's LCD business recorded a segment loss of 379 million yen, following a profit of 140 million yen in the previous fiscal year.
Aimechatec attributed the LCD business's loss to reductions in inventory values and other factors affecting the segment during the fiscal year.
The LCD business made progress with shipments to meet demand for parts, equipment modifications and additional installations during the fiscal year.
Aimechatec plans to direct management resources to its semiconductor-related and IJP solution businesses to support sustained growth, anticipating further expansion of business opportunities in those areas.
Aimechatec plans to expand its advanced AI semiconductor packaging equipment range and develop and introduce products to enter new markets, drawing on its record of business with leading companies and cooperation with business partners.
Aimechatec expects continued active capital investment in advanced AI semiconductors, supported by anticipated medium- and long-term demand growth as applications develop from generative AI toward broader implementation of AI agents and edge AI.
Aimechatec plans to develop and expand sales of bonding and debonding systems for PLP applications, where it has secured some mass-production orders, and HBM dies, where mass-production process evaluation is under way.
Aimechatec's annual order intake rose 60.6% from the previous fiscal year to 43,289 million yen.
Aimechatec's order backlog at the fiscal year-end reached 34,242 million yen, an increase of 30.7% from the previous fiscal year.